PCB routing/milling

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Actually (at least this was my impression from Gustav's plant), they drill and through-plate holes first, then apply silkscreen resist and etch tracks. Something about the electrochemical stuff working better with large copper areas.

On multilayer, "inside" tracks are etched first and laminated together, leaving outer surfaces as bare copper - then drilled, throughplated, and finally outer layer etched.

Jakob E.
 
Sorry, just watched a few videos and it seems they the apply a protecting coating through the holes and over all the traces before etching, which is removed after etching, but before the actual soldermask is applied, since the soldermask also covers much of the board, but leaves the pads and holes exposed.
 

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