People
Here is a good link on heatsinks
http://sound.westhost.com/heatsinks.htm
Heatsinks can be overlooked. I tend to use bigger than calculated if I can.
The Si devices can take some heat but sometimes the overlooked part is the heat transfered via the leads(sometimes Cu a good conductor) to the board.
Lead heat and part vibration do seem to make solder connections fail even below the melt temp.
Here is a good link on heatsinks
http://sound.westhost.com/heatsinks.htm
Heatsinks can be overlooked. I tend to use bigger than calculated if I can.
The Si devices can take some heat but sometimes the overlooked part is the heat transfered via the leads(sometimes Cu a good conductor) to the board.
Lead heat and part vibration do seem to make solder connections fail even below the melt temp.
