boji
Well-known member
Would using via's to bridge pour areas that would otherwise be left open or orphaned be a bad idea?
The only time I've seen cards peppered with trace-less via's is for thermal reasons or multi-layer pcb's, so I'm fully prepared to be told it's a no no.
I'd like your input nonetheless, thank you!
The only time I've seen cards peppered with trace-less via's is for thermal reasons or multi-layer pcb's, so I'm fully prepared to be told it's a no no.
I'd like your input nonetheless, thank you!