I visited the library of the local university today. While waiting my friend I studied an intresting book about PCB design (I don't remember the name or author anymore). It was written in late 90s but still there was a warning not to use large ground planes on the solder side of the PCB. The reason was that it collects heat from the wave solder and bends the board.
I think that was a good advise in the good old days when there was no solder mask. The bare copper collected thick layer of tin and a board with uniform ground plane really bended (cross hatch was used to avoid that).
Nowadays practically all boards come with solder mask that effectively inhibits solder stucking to the unwanted areas. So there is no reason to avoid to use bottom side ground planes anymore.
The author of the book must be expert in his area, so why he is distributing that kind of old information. Is there something that i haven't taken into account?
I think that was a good advise in the good old days when there was no solder mask. The bare copper collected thick layer of tin and a board with uniform ground plane really bended (cross hatch was used to avoid that).
Nowadays practically all boards come with solder mask that effectively inhibits solder stucking to the unwanted areas. So there is no reason to avoid to use bottom side ground planes anymore.
The author of the book must be expert in his area, so why he is distributing that kind of old information. Is there something that i haven't taken into account?