John Hardy
Well-known member
- Joined
- Jun 4, 2004
- Messages
- 98
The original 990 op-amps were potted with a clear epoxy encapsulant and silicone molds.
When the "A" and "C" versions were introduced around 1988 or so, I began using a black-anodized aluminum shell with silicone encapsulant. It is a better package from a performance standpoint. Not as fun to look at, but the silicone encapsulant is soft and does not apply as much stress on the components as the hard epoxy as things heat up and cool down, therefore expand and contract. The aluminum shell does a better job of heat-sinking the two power transistors which create most of the heat. Those two transistors were moved to the edge of the p.c. board so they are in direct contact with the wall of the shell. The aluminum shell also dissipates the heat better than the epoxy.
I usually bring an unpotted 990C to the AES conventions so folks can see what's inside. Thanks.
John Hardy
The John Hardy Co.
www.johnhardyco.com
When the "A" and "C" versions were introduced around 1988 or so, I began using a black-anodized aluminum shell with silicone encapsulant. It is a better package from a performance standpoint. Not as fun to look at, but the silicone encapsulant is soft and does not apply as much stress on the components as the hard epoxy as things heat up and cool down, therefore expand and contract. The aluminum shell does a better job of heat-sinking the two power transistors which create most of the heat. Those two transistors were moved to the edge of the p.c. board so they are in direct contact with the wall of the shell. The aluminum shell also dissipates the heat better than the epoxy.
I usually bring an unpotted 990C to the AES conventions so folks can see what's inside. Thanks.
John Hardy
The John Hardy Co.
www.johnhardyco.com