boji
Well-known member
Just curious your opinions of a lesser evil:
I have the option of increasing via count on a 2 layer board so as to, where possible, keep long traces on the inside of a PCB. The outside would have a chassis pour, sheltering the long runs across the PCB from potential adjacent channel card crosstalk.
Should I be more concerned about the capacitive aspects of adding say, an extra 25-75 vias, or the potential EMF/crosstalk of allowing long traces on the outside plane?
I can appreciate this is more art than science and that I've left out many specifics of the design/circuits. Even so, what's your instinct tell you ought to be the greater concern? Vias or signal on the outside plane next to other pcb's?
I have the option of increasing via count on a 2 layer board so as to, where possible, keep long traces on the inside of a PCB. The outside would have a chassis pour, sheltering the long runs across the PCB from potential adjacent channel card crosstalk.
Should I be more concerned about the capacitive aspects of adding say, an extra 25-75 vias, or the potential EMF/crosstalk of allowing long traces on the outside plane?
I can appreciate this is more art than science and that I've left out many specifics of the design/circuits. Even so, what's your instinct tell you ought to be the greater concern? Vias or signal on the outside plane next to other pcb's?