>> You want to avoid -- entering/exiting -- a pad with angled-routing such as this:This is more or less what I mean to do (the buses are highlighted in orange)
I hope it will not turn out to be a disaster
Thank you, will fix those right now!>> You want to avoid -- entering/exiting -- a pad with angled-routing such as this:
Thanks, I didn’t consider this aspect, I will study the matter.With all the boards having active heat producing parts component side down and no ventilation could lead to heat buildup and failures - capacitor life reduces exponentially with increase in operating temperature. Vertical board orientation allows for airflow between channel boards whereas it seems you are envisaging a flat plane which may need fan assisted cooling.
thanks for those tips, I actually don't fear replacing ICs in SMD format, I'm use to the removing and replacing of even smaller formats like those used by many microcontrollers, it becomes really fast and easy when you get used to itAnother consideration is the replacement of failed components when using SMD (also the actual build) - for such a low populated board I’d be considering through hole especially for IC’s where socketed chips make for easy replacement when they fail. I service a lot of audio gear and multi-pin IC’s in surface mount format require a bit of work to remove and especially to solder the replacement back onto the board without solder bridging - resistors and capacitors are also very small and fiddly to refit.
[would you like to share the name of the program] -- May your clicking on the link below "set you free"!!!MidnightArrakis, would you like to share the name of the program with us?
>> I found a few potential "disasters":so almost two months later, I started laying out the PCB for the input channels.
View attachment 124134
I hope it will not turn out to be a disaster
>> Try designing a PCB that is only 1.25" square (31.75mm square) that had about -- 205 -- "0201-size" Surface-Mount capacitors and resistors on -- BOTH SIDES -- of the 0.032" thick (0.813mm thick) laminate, that not only had a 256-Pin micro-BGA that required using 4-mil tracks and spacing, but also needed 8-layers with multiple split "Power & Ground" layers!!! This PCB was for a Department of Homeland Security "covert intelligence-gathering and surveillance" project!!!resistors and capacitors are also very small and fiddly to refit.
[would you like to share the name of the program] -- May your clicking on the link below "set you free"!!!
https://www.downstreamtech.com/products/cam350/
[with us?] -- Who or what is "us"?
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The want a helluva lot of information just so you can download a demo. Not a good way to win business.[would you like to share the name of the program] -- May your clicking on the link below "set you free"!!!
https://www.downstreamtech.com/products/cam350/
The number of members on this forum who design PCBs with their REF DES indicators (C3, R8, IC5, etc.) placed within the component silkscreen, so they are "hidden" after you place a component over it, astonishes me!!! How does THAT even make any sense??? It is no wonder -- WHY -- aliens have never landed here. They have concluded that THERE ARE NO INTELLIGENT LIFE FORMS HERE!!!I would hope you will do component numbering/marking on the PCB to enable servicing later on down the track. Yamaha for example label everything with clever ways of bracketing rows of components in very small layouts. Even when you’ve designed and built something yourself you will forget what went where.
As often as not I do not have a ref des on the silk screen at all. When populating a board I do not want to have to look at the ref des on the board then look up the value on schematic/BOM, then get the part and fit it. Instead I write the component value on the silk screen. I just read the silk screen, get the part and stick it in. Very handy when you have several parts with the same value as you can easily fit them in one go.The number of members on this forum who design PCBs with their REF DES indicators (C3, R8, IC5, etc.) placed within the component silkscreen, so they are "hidden" after you place a component over it, astonishes me!!! How does THAT even make any sense??? It is no wonder -- WHY -- aliens have never landed here. They have concluded that THERE ARE NO INTELLIGENT LIFE FORMS HERE!!!
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While I certainly do understand what it is that you explained about how you populate your PCB's, that is a completely different and separate issue than the one I was griping about in my comment. Once you cover-up a REF DES with a component part and a few hours or a few months later when you need to find "R8" on your board, you can't because the actual part is covering the REF DES silkscreen.As often as not I do not have a ref des on the silk screen at all. When populating a board I do not want to have to look at the ref des on the board then look up the value on schematic/BOM, then get the part and fit it. Instead I write the component value on the silk screen. I just read the silk screen, get the part and stick it in. Very handy when you have several parts with the same value as you can easily fit them in one go.
It is worth remembering that DIY is not the same as volume manufacturing.
Cheers
Ian
>> I sent their Sales Dept. a message to let them know that. I will let you know if they respond back to me.They want a helluva lot of information just so you can download a demo. Not a good way to win business.
Cheers
Ian
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