abbey road d enfer said:
However, for a designer who does not have the means or resources of having prototypes assembled industrially, SMD's are a challenge. Working with binoculars and hot-air is not my idea of fun. In comparison, working through-holes is a vacation.
I find through-hole to be a real pain in the ass to assemble. You need to put the board in your big panavise, and stuff all of the components, and bend the leads to make them stay in place when you flip the board over to solder it all in place. Then you need to snip the excess lead from the passives.
Instead, with QFPs and SOICs and 0805 passives, I just put a dab of solder on one pin, hold the part in place with tweezers, tack down the chip, and go. At this point, I'm faster at doing SMD assembly than through-hole.
And removing SMD parts is easier, too. No trying to suck solder out of a hole, especially when the hole is attached to a plane.
Just one person's experience, of course.