My comment was absolutely not a review to yours or other comment, but just another brick to the discussion as abbey's question is also interesting me somehow.
I just pass what I read from IEC document I find, that maybe help someone else.
Absolutely. No problems here.
Don't remember where I read it, if it's in the previously mentioned IEC60601, or the IEC 60204 (Safety of machinery – Electrical equipment of machines – )
But if the measurement for whatever reason should be made at the other side of the IEC socket (and not at the inside IEC faston or PE bolt) the target is 200mΩ
So from deduction, an extra 100mΩ is allowed from the IEC connector ?!?
We'll get to this.
From all I read in those IEC publications about wiring/cabling/connecting methods, this is a NO GO
I admit I also do it...have to change my habit...technical/scientifical reasons for NO soldering are more than convincing (obviously)
Cheers
Zam
I have not read the directive in full, but this is not as clear cut as it appears to be. IEC also approves PCB/Solder mount mains inlet. So, it is probably for certain applications and not a blanket cover for all.
The objection to soldering is probably from a point of view that, if the node develops sufficient temperature and the solder melts, the conduction will be compromised. However, (as I also mentioned in another discussion before) this will be the last of your concerns. What happens if your IEC is PCB/Solder mount?
The melting point for a lead free solder is >200 degrees C. To create that level of heat how much current do you need? 25A?, 50?, 100A? For an equipment that draws these sorts of current (high power power amp?) yes, but not for a preamp, let alone a keyboard. Also not to forget that the current into the equipment is limited by its mains fuse, and the fuse is there as the first line of defence.
The safety regulations are there as the bare minimum for compliance. But there can be no objection to go above that, and soldering the node after crimping is an improvement as it reduces the node resistance and we will see this later.
PICTURE NO:1 REMOVED.
Below are some examples from the industry. I m not going to give any names but these are from very well known companies, in some cases global.
In the below image the earth wire is soldered to the IEC. Though, it is wrapped around twice, so even if the solder is melted the connection is still maintained. This is from a broadcast equipment by a global brand.
In the below image the earth wire is soldered both to the IEC and the earth eyelet.
Below IEC is from a test equipment (mains voltage analyser). The earth is soldered as are the live and neutral.
Below has the earth wire soldered to both IEC and the eyelet after crimping.
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Below is a very interesting one by a very well known pro-audio brand. It is a mains distribution board. IEC is fully PCB mount. The earth connection between the IEC and the earth stud is a PCB track. The earth is distributed to the rest of the equipment including the chassis from the earth stud.
Below are some tests that I carried out using a 4 wire milliohm meter. I could not find the low value calibration resistors but I calibrated the meter using a 100 ohm 0.1% metal film resistor.
I have measured the same node for three-four times and taken the highest reading for the worst case.
Below image shows the contact resistance of an in-line IEC. The right hand side is the mains in. The left hand side is the equipment side. The earth eyelet (black probe) is crimped. I have also added a bit of wire on the mains side so that additional contact resistance on the screw point is introduced.
The below image shows the same set-up except that I have soldered the earth wire to the eyelet from its tip. This halved the contact resistance. Isn't that an improvement?
Below image shows the chassis mount IEC with the earth wire soldered on both the IEC and the eyelet. Note how much the contact resistance has improved.
LAST THREE PICTURES REMOVED