It has been a while since I was responsible for manufacturing QA (quality assurance) and the testing can vary with the SKUs. For example Power amps were routinely tested making high power, including surviving shorted outputs etc. Low power rack-mount SKUs had easier factory hurdles to clear.
Even last century, when I was last involved in large scale production testing mostly used computerized board level ATE (automated test equipment). Circuit boards were tested before installation into chassis because they are easier to repair. Test performance is monitored and adjusted as needed. Patterns of failure get fed back to the factory making the sub assemblies.
Burn-in in general is an attempt to fast forward product life to capture infant failures (maybe search bathtub curve and MTBF). Depending on the weak links, marginal solder joints, or loose hardware, can be stressed by multiple thermal cycles, like heat the sku up to operating temperature, cool down, repeat. Back in the 80s my small company put rack mount products into a burn-in rack overnight. The rack used on/off clock timers to accomplish multiple full thermal cycles during each overnight period. Of course technology and weakest links have evolved over the decades.
FWIW I wrote a piece about this for my "Audio Mythology" magazine column back in the early 1980s. Solid-state device failures are not significantly a time at elevated temperature phenomenon, more like never melt the silicon ever (one exception was metal migration inside some fine line ICs over time but not a widespread problem). OTOH electrolytic capacitor life is definitely a time at elevated temperature phenomenon as heat accelerates electrolyte loss.
Coincidentally I recall while I was writing that column, the incandescent light bulb in my desk lamp burned out when I first turned it on.
JR