clintrubber
Well-known member
jdbakker said:Going for two chips presumably allows them to use a more-analog process for the front-end and a more-digital process for the control chip. It looks like this helps them to get a few dB better low-gain noise performance than the incumbent + a pad.
They likely must have considered a two-die-in-one-package version as well.
Perhaps they didn't think it'd be a good thing to do - or is it still upcoming.
But this enters marketing territory, so I'm out. I assume at least THAT they have
an assembly flow to do a two-die package.
Regards,
Peter