[quote author="SonsOfThunder"][quote author="Svart"]thermal glue and a heatsink?[/quote]That will certainly help on a plastic DIP, [/quote]
What about mill bottom of the DIP. There must be Cu
plate for chip housing. And if you put heatsing to the bottom
with silicone fet, you can obtain some as watt...
But there are two types of attaching chips, Gold-Si solder and conductive epoxy gluing. The second is commonly used for low-power chips
without heatsink.
And what about chip buying? Minimal order of 5534Y from TI ?
I don t know, 1 000 000 ? , What about free samples ?
Then you can put it on the modified TO220, and contact it
with a gold wire...
Ha, ha, ha,... There was one man who live in the house in my town,
and this man build factory, and this man died. And factory is
still producing ... under mark ON SEMICONDUCTOR.
Someone from us can make similar nice story, to start with
TO220 5534s ?
xvlk