Found some time yesterday evening to populate the SMD parts:
I am aware that I used a lot of solder on the pads; probably enough for a competent assembler to build three of these. Me no care. I usually farm out SMD assembly, and this is probably as much parts as I've soldered all year in my day job.
The brownish residue on some places of the board is not caused by overheating; it's what Loctite/Henkel laughingly calls no-clean flux, and was left in the spots where I used their solder braid. In a way they're right; after working with their products the boards look no clean to me...
With the components on it's easy to see that this is not a very hard board to solder. There's a lot of space between the parts and (more importantly) the pads. I deliberately tried to create some solder bridges, but that proved pretty hard, and I believe it's close to impossible to
accidentally create one between SMD parts.
As you can see there are still some parts left unpopulated. These are all optional; some are there for the proto work (mostly extra frequency compensation that I hope not to need but is handy to have as a backup), some are only used if you want to go for cheap and ditch the servo in favor of a trimpot.
Populating this side of the board took me about four hours. In retrospect I could have done it faster, if only I hadn't tried to be clever.
Thing is, for placing/soldering SMD parts you really need three hands: one to hold the part (with tweezers), one for the soldering iron and one for the solder. If you only have two hands the usual approach is:
- put a blob of solder on one of the PCB pads
- put down the solder, pick up tweezers
- put the part on its pads, and use the soldering iron to melt the solder you've put on one of the pads
- remove soldering iron, hold the part steady for a second or two until the solder has cooled
- put down the tweezers, pick up the solder
- with the part now fixed on one side, solder it down on the remaining pads
This works, but I thought I could do better. Maybe I didn't need to hold the parts down? So I started placing parts on the board a dozen at a time, and soldering them all in one go. While this worked well with the SOT-23 parts and the heavier 220n 1206 capacitors, the smaller parts (predictably) started
tombstoning like crazy. I believed that I could get this under control if only I'd use the right technique, and I experimented with tip placement, more/less solder on the tip, solder application, tip removal speed/angle... This would sometimes work, but not reliably, and after an hour or two I decided to wisen up and go back to the tried and true technique I've described earlier. This worked much faster, of course. Oh well, lesson learned.
As always I spent more time getting parts out of their bags, counting them and flipping them the right side up than actually soldering them. It helps immensely if you make this a team effort, with one person prepping the parts and another soldering them down. It also helps if you aren't as anal as I am and don't insist on all resistor's values being rotated the same way...
One last observation: if you're building this pre,
don't use these pictures as a reference. I expect some parts changes, and for the next run I intend to simply bridge out all 0R-resistors.
Through-hole parts are next, but it appears I've forgotten to order the stuff needed to isolate the transistors from their heat sinks. To be continued...
JD "it's not OCD if you don't see a shrink" B.
EDIT: typo fix