Hey Tammy,
All these tips are good. Heres a summary and the way I do it:
Use a fairly fine chisel tip ideally (mine is a 1.6mm). This lets you get good heat to the pad and the componant leg at the same time.
If you can, work on a soft neoprene or similar material mat. That way when you flip the board over to solder the joints, you can press it against the mat and make sure the componants are pushed hard to the board.
Stuff the board in order of componant height. So first resistors and diodes, then the IC socket, then gold sockets (if you have them), then small caps, then IDC socket, then switches, then electro caps, then transformer. Of course you dont have to follow that order strictly, its just to give you the idea.
With large parts like electro caps, once you solder the legs and trim them, reheat the joint for a second and push the cap hard to the board. Also with multi leg things like the IC socket and IDC header, solder one pin, then reheat that joint while pushing the socket hard to the board.
Yes its important to clean your tip after every few joints. Once the residual solder on it starts to become oxidised (looses its shine) you need to wipe it off and retin it with a little fresh solder.
Contrary to popular belief, you can actually desolder and resolder those plated through boards several times. They are very strong and even though its more difficult than single sided, anyone can do it if you know how. Ive even removed one of the 1/4" sockets from the DI PCB once, without breaking any tracks. So it IS possible! Joe wrote a post about doing it a while ago, I might see if he can link to it as I dont remember what thread it was in.
Hope this helps.
M@