Kingston
Well-known member
Samuel Groner said:I use rail-to-rail decoupling all the time, with excellent results. Typically I have 2x 100 nF caps to ground, and 10-100 uF rail-to-rail for each chip. Very important is the provision for enough damping of the decoupling system--either by some small resistance in series with the rail, or the use of low-Q (electrolytic) capacitors. As far as I can tell from the limited info given about the systems where rail-to-rail decoupling has failed, insufficient damping must have been the cause. In a power supply system where no provisions for damping have been taken, the addition of a high-Q (film, ceramic) capacitor can easily provoke instability by shifting the resonance frequency into a region where the opamps have less PSRR. However, this is not the fault of rail-to-rail decoupling per se, but the omission of damping.
I admit there was no damping in the two cases I mentioned. That's certainly a cheap and good way to ensure isolation of all the opamps. I suppose (sub 0.1ohm) "damping" from the PCB rails doesn't count. Perhaps it's time for some experiments, trace cutting time!