[I've been a "fly on the wall" for this thread] -- HEY!!! WHERE'S MY CAN OF RAID???
[Some will argue that the package should be the final step. I think it should be the FIRST] -- With me being an "Electronics Packaging Designer", I couldn't agree with you more!!! However, I also do consider the circuit operation and/or performance to be an extremely close "second".
I am able to take -- most -- any electronic circuit (except vacuum-tubes) and "package" it in at least 6 different ways, each using a different type or level of technology *. And, that is just from a "physical" perspective. When I worked in an R&D laboratory at the NASA/Goddard Space Flight Center, there was this "lab sub-group" of people who could take these incredibly complex and dense 12-layer PCB's and reduce them down to a set of mathematical equations!!! From there, software code would be developed to mimic those equations and then uploaded into a custom ASIC. This group would repeat this process on several equally complex PCB's that we had designed.
Then, the group I was in would design a new 12-layer PCB using 8 or so of these custom ASIC's. After we had designed around 6 new PCB's using all of these new ASIC's, this "R&D sub-group" would then take -- THOSE -- PCB's and reduce THEM down mathematically to another custom ASIC!!! This process was repeated over and over until those geeks couldn't mathematically reduce them down any further. And, having talked and worked with some of these people.....they were "really out-there and also pretty strange" to be around!!!
Then end result of all of this??? ..... Our R&D laboratory reduced what took five 6-foot racks of electronics to do down to a single VME-rack that was only 2-1/2 feet high!!! The 5 racks of electronics had cost $500,000 to build and the new 2-1/2 foot VME-rack had "only" cost $50,000!!! And, this VME-rack was used to receive and process the signals from both The HUBBLE Space Telescope and all of the Space Shuttle missions during the 1990's and early 2000's. So.....if you have ever seen any photos from The HUBBLE Space Telescope.....I was a part of those photos.
* Although we commonly call PCB's "Printed Circuit Boards", they're not really -- printed -- per se'. The circuit image is more of a photographic image than being printed like a book or newspaper. However, there is a type of PCB where the circuit tracks are actually "printed" onto a laminate using special conductive inks. And, with how these inks are printed onto a laminate, resistor values can be "printed" between 2 connection points of the routing. So, by using this type of technology in the creation of a PCB, a circuit can literally do away with using any actual physical resistors. This type of technology then allows placing "resistors" within the inner-layers of a PCB, which then allows for the physical PCB to be much smaller. In certain "RF" environments, I have "created" capacitors by overlapping "Copper-Pours" on different layers of the PCB, so both the amount of "copper overlap" and the distance between the layers determined the amount of capacitance!!! REALLY WEIRD STUFF!!
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