It's a lot simpler than everyone says... If you are doing a whole system, like a console, then their are a lot of things to consider. If you are doing a small board or 500 module, it's pretty straight forward. Some simple rules:
If you do a ground plane, and cut out a space for a transformer, never leave the area around it connected in 360 degrees. You will pick up hum from power supplies, etc. (Eddy currents) Always cut an area out so it doesn't complete a loop.
Input grounds should go directly to the first amp, and the ground should go their too. Then connect that to the main ground.
Power should be the first thing you lay out, then all lower current things can jump over it. I usually put my power traces on the solder side.
Try to stick to the rule of one side of the board for north south and one side for east west.
Keep all balanced lines close and the same length. Unbalanced things, put a ground trace on either side.
Trace impedances are not a problem in the audio bands, as long as you keep them thick... I usually have main power 50-100 mil wide, jump offs to ships, 25 mil, and general low current traces 10 mil. Outputs to and from output transformers, 25 mil.
When selecting a board, see if they will do 2 ounce copper for the same price. The thicker the better. When you order boards, get the higher temperature ones. TG135 is for normal lead solder, TG170 is for surface mount, I always order TG180. The TG stands for Glass Transition Temperature, and is measured in degrees C, and it's when the glass becomes unstable and can start to delaminate.
Breadboard first, then I, many times, make a larger board, with things grouped, so I can prototype it and have room for mods.
Keep all AC things .150" MIN away from everything, ground plane back-off from traces is usually 10 to 12 mil.
Mix, repeat, enjoy.
If you do a ground plane, and cut out a space for a transformer, never leave the area around it connected in 360 degrees. You will pick up hum from power supplies, etc. (Eddy currents) Always cut an area out so it doesn't complete a loop.
Input grounds should go directly to the first amp, and the ground should go their too. Then connect that to the main ground.
Power should be the first thing you lay out, then all lower current things can jump over it. I usually put my power traces on the solder side.
Try to stick to the rule of one side of the board for north south and one side for east west.
Keep all balanced lines close and the same length. Unbalanced things, put a ground trace on either side.
Trace impedances are not a problem in the audio bands, as long as you keep them thick... I usually have main power 50-100 mil wide, jump offs to ships, 25 mil, and general low current traces 10 mil. Outputs to and from output transformers, 25 mil.
When selecting a board, see if they will do 2 ounce copper for the same price. The thicker the better. When you order boards, get the higher temperature ones. TG135 is for normal lead solder, TG170 is for surface mount, I always order TG180. The TG stands for Glass Transition Temperature, and is measured in degrees C, and it's when the glass becomes unstable and can start to delaminate.
Breadboard first, then I, many times, make a larger board, with things grouped, so I can prototype it and have room for mods.
Keep all AC things .150" MIN away from everything, ground plane back-off from traces is usually 10 to 12 mil.
Mix, repeat, enjoy.